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What is the difference between ceramic, high frequency and ordinary PCB boards?

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What is the difference between ceramic, high frequency and ordinary PCB boards?

Ceramic substrate is a kind of special PCB board with good thermal conductivity, insulation performance, and high dielectric constant. It is widely used in terminal products in the field of heat dissipation. Commonly used ceramic-based materials include aluminum oxide, aluminum nitride, zirconium oxide, ZTA, silicon nitride, silicon carbide, etc. FR circuit board refers to a circuit with epoxy glass fiber cloth as the main material. So, what is the difference between ceramic circuit board and ordinary PCB board

1. The difference between ceramic substrate and PCB board

a. Different materials. Ceramic substrate is an inorganic material, and the core is aluminum oxide or aluminum nitride; ordinary PCB board uses FR4 glass fiber board, which is an organic material. Ordinary PCB board can be laminated in multiple layers. LTCC is the mainstream of ceramic multilayer circuit board. The ceramic multilayer process currently being developed by Hitech Circuits Co., Ltd. is different from the traditional method. It uses magnetron sputtering technology to grow a layer of ceramic medium on the ceramic circuit board that has been metallized, and then re-metallizes this layer of medium to make the second layer of circuit.

b. The performance and application of ceramic substrates are different. The thermal conductivity of ceramic substrates far exceeds that of ordinary PCB boards. The thermal conductivity of alumina ceramics is ≧25W(m·K), and the thermal conductivity of aluminum nitride ceramics is ≧170W(m·K). They are used in industries with large heat dissipation requirements, such as high-power LED lighting, high-power modules, high-frequency communications, and track power supplies. The thermal expansion coefficient of ceramic substrates is more compatible with silicon wafers, and the product stability is higher. Ordinary PCB boards are widely used, mostly in private commercial products.

What is an HDI PCB board?

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HDI PCB boards are thin, light and compact, and can achieve high-density interconnection of PCB boards.
HDI PCB stands for high-density interconnection PCB. HDI board is the name that Japanese companies have always given to high-density interconnection printed circuit boards, while in Europe and the United States, HDI boards are called "micro-perforated boards". HDI is a PCB technology. It is a method of making high-precision circuit boards that has developed with the development of electronic technology. It can achieve high-density wiring and is generally manufactured by stacking. HDI uses conventional multi-layer boards as the core board, and then stacks insulation and circuit layers (also known as "stacked layers") layer by layer, and uses laser drilling technology for layer drilling, so that the entire printed circuit board forms a layer connection with buried holes and blind holes as the main conduction method.
Compared with PCB, HDI PCB has higher production process requirements:
According to the actual difficulty, market size and development trend of basic HDI PCB manufacturing, HDI can be divided into the following three categories:
(1) Entry level: first order (1+C+1), second order (2+C+2), third order (3+C+3)
(2) General class: any layer (n+C+n, mostly 10-12 layers).
(3) High-end class: SLP, rigid flexible PCB board (rigid board area using HDI technology)
The advantages of HDI PCB are light, thin, short and small, which can increase circuit density, facilitate the use of advanced packaging technology, greatly improve signal output quality, greatly improve the function and performance of electronic and electrical products, and make electronic products more compact and convenient in appearance. For high-end communication products, HDI PCB technology helps to improve signal integrity, facilitate strict impedance control, and improve product performance.
If you have an inquiry for HDI PCB, please contact us, Cynthia, thank you.

Flexible PCB for Display, Hitech – Your one-stop electronics manufacturing service provider and partner in China

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The characteristics of the flexible pcb for display: short assembly time, smaller, lighter, and thinner than pcb (hard board). It can be bent, wound, and folded freely to improve flexibility, Strengthen the three-dimensional assembly in a limited space. Flexible pcb has been widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, PDAs, digital cameras and other fields or products.

Technical Parameters
Product type: Flexible PCB
Material: Polypropylene, Polyimide
Application filed: Electronics Equipment
Layer/thickness: 2L/0.127mm
Surface treatment: Immersion gold(ENIG)
Line space/width: 0.15/0.15mm
Minimum hole size: 0.35mm
Technical Feature: Special materials, flex technology
If you have an inquiry for our service, please contact us, Cynthia, thank you.